LINTEC Corporation is a leading Japanese manufacturer in the field of adhesives. Our product brand, known under the name Adwill, includes dicing tapes, backgrinding tapes, backside coating tapes & dicing die-bonding tapes. The unique advantage of using Adwill products is the power to create comprehensive solutions by combining expertise in “Tape x Equipment”.
D-Series
UV Curable Dicing Tape
Adwill D-Series is an epoch-making line of UV curable dicing tapes whose features can be changed in accordance with operational processes. The tape’s strong adhesion secures wafers during dicing and is then reduced by UV irradiation to facilitate pick-up. D-Series tape is essential for high quality wafer dicing and is fully applicable to dies of multiple sizes.
Advantages
- Secures wafers with strong initial adhesion to ensure dicing without any slipping or peeling – even for small dies
- Supports instant control of adhesion by UV irradition, allowing even large dies to be picked up easily
- Causes no contamination by metal ions or by adhesive residue on the wafer backside surface, and no adverse UV irradiation effects on IC chips
- We have a variety of products to meet customers’ process and application
G-Series
Non-UV Curable Dicing Tape
The Adwill G-Series includes non-UV curable but easily removable dicing tapes. With this type of tape, adhesive strength remains stable after wafer mounting. Using a film with superb flexibility and expansion characteristics, the tape also has outstanding expandability. It can be used with dies of multiple sizes and is most reasonable in terms of cost-performance.
E-Series
UV Curable Back-Grinding Tape
The Adwill E-Series of UV curable Back Grinding Tape prevents damage to the wafer surface during back-grinding and contamination caused by grinding fluid and/or debris. The adhesion of E-Series back-grinding tapes is substantially decreased by UV irradiation after grinding, allowing for easy peeling without stress to the wafer. This feature makes this series highly suitable for the processing of thin wafers.
Standard Type (General-use)
As contamination of the wafer surface is basically eliminated, the wafer does not require cleaning after back grinding. The adhesive coating environment exceeds class 100 (US Federal Standard 209b).
Tape Types for Thin, Bump Wafers
The inherent stress relaxation capability of this tape, curtails wafer bow that would otherwise arise after back grinding due to residual stress during tape lamination. Moreover, by dispersing stress during back grinding of bump wafers, this tape prevents wafer damage and wafer dimples, while enhancing wafer thickness accuracy. High precision tape thickness accuracy ensures precision wafer thickness after back grinding.
P-Series
Non-UV Curable Back-Grinding Tape
Adwill P-Series of non-UV curable back-grinding tapes fully protects the wafer surface during grinding and prevents wafer surface contamination from infiltration of grinding fluid and/or debris. P-Series tapes perform with virtually no residual adhesive after the tape is peeled off, while its highly precise tape thickness accuracy ensures uniform wafer thickness after back–grinding.
LC-Series
Backside Coating Tape
Adwill LC Tape was developed to protect and reinforce the die backside in applications such as Flip Chip, in which the die is mounted onto a substrate from the circuit surface. While protecting and reinforcing the die backside, it also blocks light to minimize effects on the circuit surface. Unlike a coating of liquid mold material, this product is available as a tape, ensuring outstanding uniformity in thickness, and allowing the simplification of conventional processes.
Lamination can take place at relatively low temperatures so that the risk of circuit damage from heat is reduced. Featuring both high quality and stability, the tape has passed reliability tests in environments of high temperature and humidity.
This tape can be used with LINTECS’s high performance laminator (RAD-3600F/12) for tape lamination, which in turn contributes to the structuring of highly reliable production lines. The tape is laminated to the die backside before dicing, which helps prevent wafer chipping during dicing. Laser markings such as the manufacturer’s name or lot number can be inscribed on the tape’s backside.
LD-Series
Dicing Die-Bonding Tape
Adwill LD Tape is dicing die bonding tape best suited for the DBG™ (Dicing Before Grinding) process. High quality adhesive layer cutting of “LD Tape” is achieved by using full cut laser dicing after applying dicing die bonding tape to separated dies in the DBG™ process.
Advantages
- Easy pick-up allows it to be effective for ultra-thin dies.
- Available in adhesive thickness of 5µm and 7µm, enabling high density and multi-stacked packages.
LE-Series
Dicing Die-Bonding Tape
Adwill LE Tape is a high value-added tape that combines the functions of dicing tape and die bonding material. Prevents adhesive bleeding or unevenness by transferring the adhesive uniformly onto the backside of the die at pick-up. Particularly suited for die bonding of thick stacked CSPs. Processing is also simplified since the same tape can be used in the process from dicing to bonding.During dicing, the tape secures wafers in a manner similar to regular dicing tape. It is a multi-functional tape that transfers an adhesive layer to the backside when a die is picked up.Because the DAF lamination process can be omitted, processing is simplified, while damage to the wafer caused by heat treatment during adhesion is eliminated as well.Because heat curing (wafer mounting) can be done at low temperatures, the probability for damage to the wafer from heating is reduced. There are no problems such as adhesive bleeding or die tilt.Three lineups are available for following applications: one for die to die, one for die to substrate which conforms well to the bumps and depressions, and one for die to die FOW (Film On Wire).